| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed board that can prevent the reliability of interlayer connection from being deteriorated by air left in via holes as voids at the time of performing the interlayer connection, and to provide a method of manufacturing the board. <P>SOLUTION: The printed board 100 is obtained by laminating a single-sided conductive pattern film 21 having the via holes 24 and another single-sided conductive pattern film 31 and heat-pressing the films 21 and 31. At the time of laminating the films 21 and 31 upon another, the lands 22a of the conductor pattern 22 are brought into contact with the lands 32a of the conductor pattern 32. Then the lands 22a are connected to the lands 32a by arranging conductive paste 50 on the via holes 24 of the printed board 100 and heating the paste 50. Since no insulating layer is exposed between the lands 22a and 32a, air can be prevented from being left in the via holes 24 as voids. <P>COPYRIGHT: (C)2004,JPO</p> |
