| 摘要 |
PROBLEM TO BE SOLVED: To provide an aggregate substrate for protecting chip parts from stress produced in division. SOLUTION: On the aggregate substrate 1, a plurality of circuit boards 2 are individually separably formed along a prescribed division line 3. Each circuit board 2 has a mounting pattern part 6 for mounting the chip parts 5 and a notch part 7 entering the inside of the circuit board 2 from the division line 3 so as to correspond to the mounting pattern 6 arranged adjacent to the division line 3. When the chip parts 5 are mounted and then external force is applied along the division line 3 to separate each circuit board 2, the notch part 7 disperses the external force, and prevents damage of the chip parts 5 mounted on the corresponding mounting pattern part 6. The substrate 1 includes a slit 4 are punched in advance between the adjacent circuit boards 2, and performs punching processing together with the notch part 7. COPYRIGHT: (C)2004,JPO
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