| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module with highly reliable junctions. SOLUTION: The thermoelectric module comprises supporting substrates 1, 2; a plurality of thermoelectric elements 5 arranged on the supporting substrate 1, 2; leads 3, 4 establishing electrical connection between the thermoelectric elements 5; and external connection terminals 9 provided on the supporting substrate 1, 2 and electrically connected to the wiring leads 3, 4. Each of the thermoelectric elements 5 is bonded to the wiring leads 3, 4 via solder layers 6 composed of an Au-Sn solder containing not more than 500 ppm of oxygen. The Au contained in the solder layers 6 preferably occupies 10-85 mass% in the solder, and the solder layers 6 preferably have a thickness of 10-100μm. COPYRIGHT: (C)2004,JPO
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