| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer wherein a surface and a back can be distinguished surely after polishing both of the surfaces. SOLUTION: When bevelling of the wafer on which a temporary notch is arranged is performed, bevelling of all periphery is performed to bevelling parts at outer peripheries of the surface and the back by using e.g. abrasive particle of #1000. Further, in the bevelling part of the surface, bevelling is performed to a part which is turned around the outer periphery e.g. 170-190°from the temporary notch by using abrasive particle of #3000, and a pattern formed of surface roughness which is not uniform is formed. The wafer wherein the surface and the back can be recognized only by observing one side of the wafer is manufactured. COPYRIGHT: (C)2004,JPO
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