ENCLOSURE STRUCTURE OF ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To increase heat dissipation effect without increasing the size of an enclosure in the hermetic type enclosure. SOLUTION: The enclosure structure comprises: a fan 2 that is provided at the upper portion of the enclosure 1 that is sealed and accommodates a heat generation section and discharges wind downward; and a straightening vane 3 for straighten wind from the fan so that it flows along an enclosure wall surface. COPYRIGHT: (C)2004,JPO