| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric hybrid type semiconductor device with high performance positively which realizes compactness, low cost and high speed at the same time. SOLUTION: On the main surface of a semiconductor substrate 11, a groove part 11a and a recessed part 11b which is connected to the groove part 11a are formed. The opening dimension of the recessed part 11b is formed to be smaller than the dimension of the semiconductor substrate 11, in the direction which crosses the direction in which the groove part 11a extends. On the main surface of the semiconductor substrate 11, a semiconductor integrated circuit 12 is formed continuous with an optical fiber packaging region R1 and an optical element packaging region R2. An optical element chip 18 is packaged so that the direction in which the groove part 11a extends and the direction of an optical axis match. Also, an optical fiber 19 is packaged along the groove part 11a in order that the end surface may touch the wall surface of the recessed part 11b. COPYRIGHT: (C)2004,JPO
|
