| 发明名称 |
MODULE COMPONENT |
| 摘要 |
<p>A module component comprises a mount part, a circuit board on which the mount part is mounted, a first ground pattern provide on the peripheral region of the surface of the circuit board, a first sealing body provided on the circuit board, having a projected area on the circuit board smaller than the area of the profile of the circuit board, formed of a first resin, and adapted to seal the mount part, and a metal film covering the surface of the sealing body and connected to the ground pattern. The module component has a low height and exhibits a sufficient shielding effect.</p> |
| 申请公布号 |
WO2004010499(A1) |
申请公布日期 |
2004.01.29 |
| 申请号 |
WO2003JP07598 |
申请日期 |
2003.06.16 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;TSUNEOKA, MICHIAKI;HASHIMOTO, KOJI;HAYAMA, MASAAKI;YASUHO, TAKEO |
发明人 |
TSUNEOKA, MICHIAKI;HASHIMOTO, KOJI;HAYAMA, MASAAKI;YASUHO, TAKEO |
| 分类号 |
H01L21/60;H01L23/31;H01L23/552;H01L23/60;H05K1/02;H05K3/28;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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