| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable for use under an exposure light source of ≤160 nm, particularly F<SB>2</SB>excimer laser light (157 nm), and specifically, to provide a positive resist composition having satisfactory transmittance when a light source of 157 nm is used and excellent in various properties such as suitability to coating, uniformity of film thickness, affinity to a developing solution, image forming property and dry etching resistance. <P>SOLUTION: The positive resist composition comprises a resin (A) having an alicyclic structure having at least one group selected from the collection consisting of F, Cl, hydroxy, cyano, alkyl and alkoxy and a repeating unit (Y) having at least one F atom, and a compound (B) which generates an acid upon irradiation with actinic rays or radioactive rays. <P>COPYRIGHT: (C)2004,JPO |
