| 摘要 |
PROBLEM TO BE SOLVED: To prevent a sag of an insulator due to the roughness and fineness of a wiring layer with respect to a packaging circuit resin board with a thin film. SOLUTION: A sag-preventing pattern 3 is provided at the end part of a packaging circuit resin board with a thin film having an interlayer insulation film 4 that is provided between a lower wiring layer and an upper wiring layer comprising a dry film, adjoining the region with the relatively high density of at least an actual wiring layer 2 on the end part side of the board from the actual wiring layer 2. COPYRIGHT: (C)2004,JPO |
