POSITIONING DEVICE AND ITS CONTROL METHOD, ALIGNER, MANUFACTURING METHOD OF DEVICE, SEMICONDUCTOR MANUFACTURE PLANT, MAINTENANCE PROCEDURE OF ALIGNER

摘要

PROBLEM TO BE SOLVED: To highly accurately measure a position by changing over a plurality of position measuring instruments. SOLUTION: The positioning device comprises x-axial interferometers 3 and 4 for measuring the position information of a wafer stage 7; a changeover instrument for changing over the positioning measuring instrument from the X-axial interferometer 3 to the X-axial interferometer 4 in response to a moving region of the wafer stage 7; a correction computing element correcting and computing as a current position of the wafer stage 7 by using a first parameter set for a measured result by the X-axial interferometer 3; a position control part for generating a signal for driving the wafer stage 7 to a target position on the basis of a corrected and computed result by the correction computing element; and a reverse computing element computing as an command value to the X-axial interferometer 4 by using a second correction parameter set generated with the position control part. Thereby the position of the wafer stage 7 is highly accurately measured by changing over the plurality of the position measuring instruments. COPYRIGHT: (C)2004,JPO