发明名称 WIRING BOARD FOR INSPECTING ELECTRONIC COMPONENT AND METHOD FOR VISUALLY INSPECTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic component inspecting wiring board which can be brought into contact with the protruded electrodes of an electronic component with low resistance stably by breaking through the oxide films of the protruded electrodes, when the electronic component is inspected causing currents to flow in, and prevents its contacting portions with the protruded electrodes from coming off in an energization test of the electronic component. SOLUTION: The inspecting wiring board 1 has contacts formed on an insulating board 2 on which a wiring pattern 7 has been formed, to be electrically connected to the protruded electrodes 9 of the electronic component 8. The contacts 5 are ring-shaped, and their internal diameter is smaller than the diameter of the protruded electrodes of the electronic component, and parts of their internal circumferences are protruded inwards. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004028810(A) 申请公布日期 2004.01.29
申请号 JP20020186024 申请日期 2002.06.26
申请人 NEC KANSAI LTD 发明人 MAGOI GOUJI;HATA SHOICHI;KAWABATA SADANORI
分类号 G01R31/26;G01N21/956;G01R1/073;G01R31/28;(IPC1-7):G01R1/073 主分类号 G01R31/26
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