发明名称 |
Land grid array structures and methods for engineering change |
摘要 |
A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.
|
申请公布号 |
US2004016114(A1) |
申请公布日期 |
2004.01.29 |
申请号 |
US20020202726 |
申请日期 |
2002.07.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MCALLISTER MICHAEL F.;TOROK JOHN G. |
分类号 |
H05K1/00;H05K1/14;H05K1/16;H05K3/32;H05K3/34;H05K3/42;(IPC1-7):H05K3/20 |
主分类号 |
H05K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|