CURABLE RESIN COMPOSITION FOR COATING, MULTILAYER PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND DRY FILM

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition for coating capable of forming a low dielectric interlayer insulating film in which even signals in high frequency circuit are hardly attenuated, a multilayer printed circuit board and a printed circuit board having a cured coating of the same, and a dry film having a semi-cured coating of the same.

SOLUTION: A thermosetting resin composition for coating comprising a multifunctional vinyl benzyl ether compound and a curing accelerator is obtained. The composition is further mixed with a photosensitive resin, a photopolymerization initiator and a diluent to obtain a photosensitive, thermosetting resin composition for coating. The multilayer printed circuit board and printed circuit board using the cured coating of the composition and the dry film comprising the semi-cured coating are obtained.

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