| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a highly reliable solid-state image pickup device can be manufactured easily. SOLUTION: This method of manufacturing the solid-state image pickup device includes a step of forming a plurality of solid-state image pickup elements 100 on the surface of a semiconductor substrate, a step of joining a light-transmissive member 200 to the surface of the substrate so that a gap may be formed correspondingly to the light receiving area of each image pickup element 100, and a step of forming through grooves 108 having internal walls made of conductors through the substrate in separating areas DC which separate the image pickup elements 100 formed on the surface of the substrate from each other and their peripheral sections before or after the joining step. This method also includes a step of separating the joined body obtained in the joining step at every image pickup element 100 in the separating areas DC so as to leave side-wall wiring sections 109 constituted of parts of the through grooves 108 having side walls made of conductors. COPYRIGHT: (C)2004,JPO
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