| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical interconnection device which can be miniaturized still more, can easily cope with a change of a circuit and can reduce production costs; and an interconnection module structuring the optical interconnection device. SOLUTION: For example, a surface-emitting semiconductor laser 21 and a driver IC 22 are three-dimensionally disposed across a sub-mount substrate 20a, and an LSI 23 such as a CPU or the like is mounted on the driver IC 22. Through holes are provided in all of the sub-mount substrate 20a, the surface-emitting semiconductor laser 21, the driver IC 22 and the LSI 23, and these parts are electrically connected through conductors in the through holes. COPYRIGHT: (C)2004,JPO
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