| 摘要 |
The present invention is directed to achieving a desired the process uniformity of a substrate by modifying the distribution of thermal coupling between the substrate and the heater which heats the substrate. In one embodiment, the method comprises establishing a correlation between a uniformity parameter of the process to be performed on the substrate and a surface feature of a heater surface of the heater which is in substantially full contact with a bottom surface of the substrate. The method further comprises determining a desired surface feature of the heater surface of the heater in substantially full contact with the substrate, based on the correlation between the uniformity parameter of the process to be performed on the substrate and the surface feature of the heater surface of the heater, to achieve a preset process uniformity of the uniformity parameter.
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