METHOD FOR FORMING A PACKAGE FOR ELECTRONIC COMPONENTS AND PACKAGE FOR ELECTRONIC COMPONENTS

摘要

A package (30) for electronic components comprises substantially sheet-like elements in a stack: a heat sink (32); a flexible substrate (34) carrying at least one conductor layer (36) and at least one electronic component (40); a gap filler (42); and a lid (44); wherein the gap filler applies a pressure to the flexible substrate such that the flexible substrate and the heat sink are in mechanical contact. The method of forming the package is performed without an adhesive being used. The package can easily be combined with ribbon cables.