发明名称 |
METHOD OF PREVENTING SHIFT OF ALIGNMENT MARKS DURING RAPID THERMAL PROCESSING |
摘要 |
<p>A method for preventing thermal stress and the shifting of alignment marks during semiconductor processing including providing a semiconductor wafer (10) having a first selected portion (12) for fabricating integrated circuitry and a second non-fabrication portion (14) including alignment marks (16), introducing dopant (56) into said first and second portions, when dopant (56) is required to be introduced in said first portion (12), thereby increasing radiant energy absorptivity and decreasing radiant energy transmissivity in both portions (12, 14) such that the thermal emissions detected at the portions result in no significant temperature variation between portions during heating. Therefore thermal stress and shifting of alignment marks (16) are prevented.</p> |
申请公布号 |
WO2004010493(A1) |
申请公布日期 |
2004.01.29 |
申请号 |
WO2003US17404 |
申请日期 |
2003.06.02 |
申请人 |
ATMEL CORPORATION |
发明人 |
LOJEK, BOHUMIL;WHITEMAN, MICHAEL, D. |
分类号 |
H01L27/088;H01L21/265;H01L21/324;H01L21/8234;H01L23/544;(IPC1-7):H01L21/76 |
主分类号 |
H01L27/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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