| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an embedding resin composition for embedding an electronic part in the inner part of a board and a wiring board obtained by embedding the electronic part with the use of the embedding resin composition which well fill a gap between the electronic part housed in the inner part of the board and and the board. <P>SOLUTION: The resin composition 22 for embedding an electronic part 17 in the inner part of a wiring board 1 comprises an inorganic filler, a thermal cationic polymerization catalyst, and two or more resins. And at least one of these two or more resins is an alicyclic epoxy resin or an oxetane resin as the thermosetting resin, and the one having a low viscosity of not higher than 1,000 mPas (25°C) is used. Herein, the resin composition 22 is required to have properties such as moisture resistance, heat resistance, and insulation properties, and furthermore is required to reduce viscosity in order to enhance embedding properties but use of the alicyclic epoxy resin or oxetane resin can remarkably reduce viscosity without greatly deteriorating properties such as moisture resistance and heat resistance. As a result, a gap between the electronic part 17 and the board 1 can be surely filled. <P>COPYRIGHT: (C)2004,JPO |
