| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding stage and a bonding tool for use in mounting a semiconductor element to a substrate or the like, wherein a high-accurate bonding is possible also for a design of arranging an electrode in the semiconductor element and the substrate with a high density. <P>SOLUTION: An upper surface of a stage which comes into contact with the semiconductor element is constituted by a high-heat conductivity substance, and an in-plane temperature distribution is good. Further, since a material having a low wettability with respect to a material such as an epoxy resin or the like is used for the surface of the stage, it is difficult for a resin material to adhere in use, and it is easy to remove the adhered resin. <P>COPYRIGHT: (C)2004,JPO</p> |
