| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic circuit board wherein a metal plate is positioned and bonded accurately and firmly to a ceramic substrate. SOLUTION: The method for manufacturing a ceramic circuit board 6 comprises: a step of preparing a ceramic substrate 1 and a circuit-patterned metal plate 4; a step of forming an active metal braze paste layer 2 by printing a circuit pattern of the metal plate 4 on the ceramic substrate 1 by using an active metal braze paste; a step of applying the active metal braze paste to a part of the active metal braze paste layer 2 for formation of a plurality of protrusions 3; and a step of mounting the metal plate 4 on the active metal braze paste layer 2 with the protrusions 3 in between and of heating them in a non-oxidizing atmosphere for bonding together the ceramic substrate 1 and the metal plate 4 with an active metal braze layer 5 formed by heating and melting the active metal braze paste layer 2 and the protrusions 3. The steps are executed in the mentioned order. COPYRIGHT: (C)2004,JPO
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