| 摘要 |
PROBLEM TO BE SOLVED: To provide printed wiring board materials for obtaining a printed wiring board coping with pitch narrowing with high yield by reducing fine pin holes whose diameters are 10μm or less even when the thickness of a metallic layer formed on a polymer base material is 1μm or less. SOLUTION: The acidic treatment of a polymer base material 100 is preliminarily carried out, and a metallic layer 101 is formed on the acidic treatment surface. Thus, it is possible to provide a laminate in which a metallic layer whose thickness ranges from 1 to 1000nm is formed at least on one face side of the polymer base material. COPYRIGHT: (C)2004,JPO
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