发明名称 ELECTROLESS PLATING METHOD AND METHOD FOR FORMING ELECTRODE OF PIEZOELECTRIC BASE FOR SHEARING MODE TYPE INK JET HEAD
摘要 PROBLEM TO BE SOLVED: To provide an electroless plating method by which a plating film can stably be formed on a base material having rugged parts, and to provide a method for forming an electrode of a piezoelectric base for a shearing mode type ink jet head by which a plating film (electrode layer) electrode is formed on the side walls of grooves and planes connected to the grooves. SOLUTION: In the electroless plating method where plating is performed to a base material having a plurality of rugged shapes, the electroless plating is performed while the base material is rotated at the revolution of 200 to 1,000 rpm in an electroless plating liquid. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004027248(A) 申请公布日期 2004.01.29
申请号 JP20020181447 申请日期 2002.06.21
申请人 KONICA MINOLTA HOLDINGS INC 发明人 UENO NOBUTAKA;NISHI YASUO;ITO TAKESHI
分类号 B41J2/16;C23C18/31;C23C18/34;(IPC1-7):C23C18/31 主分类号 B41J2/16
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