发明名称 |
ELECTROLESS PLATING METHOD AND METHOD FOR FORMING ELECTRODE OF PIEZOELECTRIC BASE FOR SHEARING MODE TYPE INK JET HEAD |
摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating method by which a plating film can stably be formed on a base material having rugged parts, and to provide a method for forming an electrode of a piezoelectric base for a shearing mode type ink jet head by which a plating film (electrode layer) electrode is formed on the side walls of grooves and planes connected to the grooves. SOLUTION: In the electroless plating method where plating is performed to a base material having a plurality of rugged shapes, the electroless plating is performed while the base material is rotated at the revolution of 200 to 1,000 rpm in an electroless plating liquid. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004027248(A) |
申请公布日期 |
2004.01.29 |
申请号 |
JP20020181447 |
申请日期 |
2002.06.21 |
申请人 |
KONICA MINOLTA HOLDINGS INC |
发明人 |
UENO NOBUTAKA;NISHI YASUO;ITO TAKESHI |
分类号 |
B41J2/16;C23C18/31;C23C18/34;(IPC1-7):C23C18/31 |
主分类号 |
B41J2/16 |
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