DEVICE AND METHOD FOR MOUNTING PARTS

摘要

PROBLEM TO BE SOLVED: To realize the mounting of parts on substrates differing in size without changing a stage to mount (electronic) parts onto the substrates. SOLUTION: The distance L of a substrate 2 that protrudes from a stage 84 is controlled by a controller 86 so as to be always constant irrespective of the size of the substrate 2 held by adsorption on the stage 84. Thus, it becomes unnecessary to change the stage according to the sizes of the substrate, therefore, the number of manhours for assembling the substrate are largely reduced and a manufacturing efficiency is improved. COPYRIGHT: (C)2004,JPO