发明名称 |
POLISHING PAD FOR ENDPOINT DETECTION AND RELATED METHODS |
摘要 |
A polishing pad has a polishing layer (22) with a polishing surface (24) and a back surface. A plurality of grooves (28b) are formed on the polishing surface, and an indentation (52) is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves (28a). |
申请公布号 |
WO2004009291(A1) |
申请公布日期 |
2004.01.29 |
申请号 |
WO2003US23065 |
申请日期 |
2003.07.23 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
SWEDEK, BOGUSLAW, A.;BIRANG, MANOOCHER |
分类号 |
B24B49/10;B24B37/013;B24B37/20;B24B37/26;B24B49/02;B24B49/12;B24D7/12;B24D11/00;B24D13/14;H01L21/304 |
主分类号 |
B24B49/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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