发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide an excellent photosensitive resin composition showing a sufficient transmitting property when an exposure light source at &le;160 nm wavelength, specifically F<SB>2</SB>excimer laser light (at 157 nm) is used, and having low line edge roughness and dependence on developing time. <P>SOLUTION: The photosensitive resin composition contains (A) a resin which has a repeating unit expressed by general formula (IA) and a repeating unit having an acid decomposing group and copolymerizable with the repeating unit of formula (IA) and which is decomposed by the effect of an acid to increase the solubility with an alkali developer solution, (B1) a compound which produces an aliphatic or aromatic sulfonic acid substituted with at least one fluorine atom, by irradiation of active rays or radiation, (B2) a compound which produces an aliphatic or aromatic sulfonic acid containing no fluorine atom or an aliphatic or aromatic carboxylic acid by irradiation of active rays or radiation, and (C) a solvent. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004029724(A) 申请公布日期 2004.01.29
申请号 JP20030060085 申请日期 2003.03.06
申请人 FUJI PHOTO FILM CO LTD 发明人 MIZUTANI KAZUYOSHI;KANNA SHINICHI
分类号 G03F7/039;H01L21/027 主分类号 G03F7/039
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