发明名称 LAMINATED CAPACITOR AND ITS MANUFACTURING METHOD, AND WIRING BOARD, DECOUPLING CIRCUIT AND HIGH-FREQUENCY CIRCUIT INCORPORATING THE SAME
摘要 PROBLEM TO BE SOLVED: To minimize an equivalent series inductance and attain a large capacitance. SOLUTION: The laminated capacitor is provided with first and second main surface terminal electrodes formed respectively on first and second main surfaces of its main body. The first and second side surface terminal electrodes are formed on four side surfaces of the main body. The main body is divided into a low ESL part on the first main surface side and a large capacitance part on the second main surface side. The low ESL part is provided with first and second low ESL internal electrodes; a first via hole conductor that electrically connects a first low ESL internal electrode with the first main surface terminal electrode; and a second via hole conductor that electrically connects a second low ESL internal electrode with the second main surface terminal electrode. The large capacitance part is provided with first and second large capacitance internal electrodes; a first lead-out electrode that electrically connects a first large capacitance internal electrode with the first side surface terminal electrode; and a second lead-out electrode that electrically connects a second large capacitance internal electrode with the second side surface terminal electrode. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004031926(A) 申请公布日期 2004.01.29
申请号 JP20030118133 申请日期 2003.04.23
申请人 MURATA MFG CO LTD;INTEL CORP 发明人 NAITO YASUYUKI;TANIGUCHI MASAAKI;KURODA YOICHI;HORI HARUO;FIGUEROA DAVID G;RODRIGUEZ JORGE P;WATTS NICHOLAS R;HOLMBERG NICHOLAS L;HIOKI TAKESHI
分类号 H01G4/30;H01G4/232;H01G4/40;H01L23/12;H05K1/02;H05K1/18;(IPC1-7):H01G4/40 主分类号 H01G4/30
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