发明名称 |
COPPER AND COPPER ALLOY AND HEAT TREATMENT METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide low-cost copper and copper alloy in which energy efficiency by heat treatment is improved by microfabricating the mean crystal grain size of the copper and copper alloy after the heat treatment and realizing the low temperature heat treatment. SOLUTION: The copper or copper alloy is rapidly heated to reduce its recrystallization temperature. Its temperature is raised at least to the reduced recrystallization temperature. Immediately after that, it is held at the recrystallization temperature, or is cooled. The copper or copper alloy is held at an ultimately raised temperature or lower, and is recrystallized. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004027298(A) |
申请公布日期 |
2004.01.29 |
申请号 |
JP20020185907 |
申请日期 |
2002.06.26 |
申请人 |
NIPPON MINING & METALS CO LTD |
发明人 |
MORI MASAZUMI;NISHI YOSHITERU |
分类号 |
C22F1/08;C22C9/02;C22F1/00;(IPC1-7):C22F1/08 |
主分类号 |
C22F1/08 |
代理机构 |
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代理人 |
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地址 |
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