发明名称 Solid state image pickup device and manufacturing method therefor
摘要 In a solid state image pickup device, in order to form a bypass region with precisely controlled impurity concentration and width, there is provided a solid state image pickup device comprising a photoelectric conversion unit composed of a first region of a first conductive type formed on a semiconductor substrate and having a principal surface, a second region of a second conductive type formed in the first region, and a third region of the first conductive type present between the second region and the principal surface, a fourth region of the second conductive type formed in the first region, and a charge transfer unit including the first region, an insulation layer on the first region and a control electrode provided on the insulation layer, for transferring a signal charge accumulated in the photoelectric conversion unit, to the fourth region, wherein the photoelectric conversion unit and the charge transfer unit are connected through a fifth region of the second conductive type.
申请公布号 US2004017496(A1) 申请公布日期 2004.01.29
申请号 US20030622540 申请日期 2003.07.21
申请人 KOIZUMI TORU;SUGAWA SHIGETOSHI;UENO ISAMU;KOCHI TETSUNOBU;SAKURAI KATSUHITO;HIYAMA HIROKI 发明人 KOIZUMI TORU;SUGAWA SHIGETOSHI;UENO ISAMU;KOCHI TETSUNOBU;SAKURAI KATSUHITO;HIYAMA HIROKI
分类号 H04N1/028;H01L27/146;H01L31/10;H04N1/19;(IPC1-7):H04N5/335 主分类号 H04N1/028
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