| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that adhesive agent of a dicing tape is scattered in a direction of rotation of a dicing blade, the scattered adhesive agent is stuck on a surface of a resin sealed member and a lead (external terminal), and electrical imperfect connection or the like on a surface of the external terminal is generated, since the dicing blade rotates onto the adhesive agent of the dicing tape in a process wherein a plurality of semiconductor chips sealed by sealing resin are divided into individual chips. <P>SOLUTION: Before the resin sealed member 15 is cut into every semiconductor chip by dicing, irradiation of ultraviolet ray is performed, and the ultraviolet ray setting type adhesive agent 17 between the dicing tape 16 and the resin sealed member 15 is cured. <P>COPYRIGHT: (C)2004,JPO</p> |
