ELECTRIC COMPONENT PACKAGING SUBSTRATE DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an electric component packaging device which can enlarge a packaging area of an electric component.

SOLUTION: The device has a cavity 2 in a component packaging surface of a substrate 1 which is constituted by laminating a dielectric, and an electric component 4 packaged therein which is electrically connected to a conductive pattern 1a formed over the cavity in the substrate.

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