| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To surely obtain a resin insulating layer having a required thickness and ideal flatness without being affected by the formed states of hole sections in a plate which becomes a core material. <P>SOLUTION: In a laminated resin wiring board 11, the plate 12 having a plurality of hole sections 15 on both main surfaces 13 and 14 is used as the core material. The plate 12 has a region 91 in which the degree of congestion of the hole sections 15 is relatively high and another region 92 in which the degree of congestion of the hole sections 15 is relatively low when the plate 12 is viewed from the fist main surface 13 side. On both main surfaces 13 and 14 of the plate 12, resin insulating layers 21 and 22 are respectively formed and wiring layers 31 and 32 are respectively formed on the layers 21 and 22. At the time of manufacturing a laminated resin wiring board, the resin insulating layers 21 and 22 are respectively formed to have larger thicknesses than required ones on both surfaces 13 and 14 of the plate 12 by laminating and press-fitting film-like insulating resin materials 93 and 94 upon and to the surfaces 13 and 14. Simultaneously, the hole sections 15 are filled up. Then the insulating layers 21 and 22 are flattened by removing the surfaces of the layers 21 and 22 until the thicknesses of the layers 21 and 22 become the required ones. <P>COPYRIGHT: (C)2004,JPO</p> |
