发明名称 INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide an integrated circuit, including an induction element and a capacitance element while being provided with a contracted semiconductor die area. SOLUTION: A capacitor 22 is constituted of a first annular conductive material layer 30 and a second annular conductive material layer 39. A dielectric material layer 36 is arranged between the first and second conductive material layers 30, 39. An inductor 21 is formed on the dielectric material layer 36 and the inductor 21 is substantially surrounded by the second conductive material layer 39. An electric interconnection unit 33 is extended from one side of the first conductive material layer 30 toward the center of the first conductive material layer 30 and is terminated at an end part 34 positioned at the center of the first conductive material layer 30. A passage 37 penetrates through the dielectric material layer 36 while the end part 34 of the electric interconnection unit 33 is connected to the inductor 21. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004031936(A) 申请公布日期 2004.01.29
申请号 JP20030141664 申请日期 2003.05.20
申请人 MOTOROLA INC 发明人 STAUDINGER JOSEPH;SEELY WARREN L;PATTERSON HOWARD W
分类号 H01G4/40;H01L21/822;H01L27/04;H01L27/08;H03H5/02;H03H7/075;(IPC1-7):H01L21/822 主分类号 H01G4/40
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