| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an infrared data communication module capable of coping with the miniaturization of electronic equipment. <P>SOLUTION: A main body 30 is coated with a shield case 11, and a connection piece 15 formed on a back face 11C of the shield case 11 is brought into contact with a wiring terminal part 14 of a printed wiring board 2. Thus, at the time of mounting an infrared data communication module 1 on a printed wiring board 8 of electronic equipment, a connection piece 15 for soldering of the shield case 11 can be electrically connected to the ground pattern of the printed wiring board 8 simultaneously with a wiring terminal 14 by a solder flow. Therefore, the mounting face of the infrared data communication module 1 can be housed in the frame of the shield case 11, and the miniaturization of the electronic equipment can be achieved. <P>COPYRIGHT: (C)2004,JPO |
