| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electric circuit board where a metal foil-clad laminate is not used as a substrate and a process dispenses with an etching process and a resist process, thereby capable of shortening processes such as a conventional circuit board and saving resources and energy and further capable of simultaneously manufacturing a plated through hole. SOLUTION: In the method of manufacturing the electric circuit board, a desired pattern comprising a catalyst layer having a monomer polymerization capacity is directly formed on the board and is subsequently polymerized by the catalyst, after the polymerization, a monomer component which produces a conductive polymer is allowed to contact the pattern, after a patterned conductive macromolecular layer corresponding to the pattern of the catalyst layer is obtained, a metallic circuit pattern is formed by performing metal plating on the patterned conductive polymer layer. COPYRIGHT: (C)2004,JPO
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