摘要 |
PROBLEM TO BE SOLVED: To provide a silicone rubber composition affording a lightweight silicone rubber cured product having low heat conductivity, excellent heat resistance and good dimensional stability during heating and comprising a filler made of an organic resin and an inorganic filler. SOLUTION: The heat-curing silicone rubber composition comprises (A) 100 pts. wt. of a heat-curing organopolysiloxane composition, (B) 0.1-30 pts. wt. of a hollow microfiller made of an unexpanded organic resin expandable by heat or a hollow microfiller made of an expanded organic resin and (C) 2-70 pts. wt. of an inorganic hollow filler. The silicone rubber composition provides a lightweight silicone rubber molded product having the low heat conductivity, a small coefficient of thermal expansion and the excellent dimensional stability. COPYRIGHT: (C)2004,JPO
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