发明名称 METHOD AND APPARATUS FOR CUTTING GLASS SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method of cutting a substrate by which scribing and breaking are simultaneously and continuously carried out by a simple structural apparatus and the apparatus. SOLUTION: In the method of cutting the substrate such as a glass substrate, the breaking is carried out at the same time when stress is loaded from one surface of the substrate with a pressing edge and a scribe line is drawn on another surface of the substrate opposed to the pressing edge by a scribing means such as scribing cutter. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004026539(A) 申请公布日期 2004.01.29
申请号 JP20020182657 申请日期 2002.06.24
申请人 NAKAMURA TOME PRECISION IND 发明人 SAIDA HAJIME
分类号 G02F1/13;C03B33/023;C03B33/033;C03B33/037;G02F1/1333;(IPC1-7):C03B33/023;G02F1/133 主分类号 G02F1/13
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