发明名称 |
METHOD AND APPARATUS FOR CUTTING GLASS SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of cutting a substrate by which scribing and breaking are simultaneously and continuously carried out by a simple structural apparatus and the apparatus. SOLUTION: In the method of cutting the substrate such as a glass substrate, the breaking is carried out at the same time when stress is loaded from one surface of the substrate with a pressing edge and a scribe line is drawn on another surface of the substrate opposed to the pressing edge by a scribing means such as scribing cutter. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004026539(A) |
申请公布日期 |
2004.01.29 |
申请号 |
JP20020182657 |
申请日期 |
2002.06.24 |
申请人 |
NAKAMURA TOME PRECISION IND |
发明人 |
SAIDA HAJIME |
分类号 |
G02F1/13;C03B33/023;C03B33/033;C03B33/037;G02F1/1333;(IPC1-7):C03B33/023;G02F1/133 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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