发明名称 METHOD FOR MANUFACTURING ALUMINUM NITRIDE SINTERED COMPACT BY GRINDING OR POLISHING SURFACE
摘要 PROBLEM TO BE SOLVED: To provide an aluminum nitride sintered compact having a metallized layer which has the high adhesion strength between aluminum nitride and the metallized layer and is free of cracks in the metallized layer. SOLUTION: The aluminum nitride sintered compact having the metallized layer is manufactured by applying a paste containing W powder as a conductor high melting metal to a ceramic green sheet essentially consisting of the aluminum nitride, then simultaneously sintering the entire part thereof. At this time, the surface layer of the aluminum nitride sintered compact is removed by more than one-fourth the thickness of the aluminum nitride sintered compact by grinding or polishing after simultaneous sintering. As a result, the occurrence of cracks in vias by the grinding or polishing can be prevented. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004026522(A) 申请公布日期 2004.01.29
申请号 JP20020181342 申请日期 2002.06.21
申请人 SUMITOMO ELECTRIC IND LTD 发明人 HIROSE YOSHIYUKI;CHIKUNO TAKASHI
分类号 C04B41/91;(IPC1-7):C04B41/91 主分类号 C04B41/91
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