发明名称 |
Method of making a circuitized substrate and the resultant circuitized substrate |
摘要 |
A circuitized substrate and a method of making the circuitized substrate is provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.
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申请公布号 |
US2004016794(A1) |
申请公布日期 |
2004.01.29 |
申请号 |
US20020205136 |
申请日期 |
2002.07.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GOSSELIN TIMOTHY A.;MEAD DONALD I. |
分类号 |
H01L23/498;H05K3/34;(IPC1-7):B23K1/20 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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