| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a crack occurring in a connecting part of a semiconductor device to a mounting board by a thermal stress when the semiconductor device is mounted on a printed board or the like. <P>SOLUTION: The semiconductor device includes a semiconductor element 1 having a thickness of 200 μm or less, an electrode pad 2 formed on the semiconductor element 1, a wiring 3 electrically connected to the electrode pad 2, and a sealing resin 4 for sealing a circuit forming surface of the semiconductor element and the wiring. A method for manufacturing the semiconductor element includes a step of forming the electrode pad 2 on a main surface of a semiconductor wafer, a step of forming the wiring 3 connected to the electrode pad, a step of resin-sealing the main surface of the semiconductor wafer and the wiring, a step of forming a groove from the surface of the resin, a step of reaching a predetermined depth of the semiconductor wafer, and a step of polishing the rear surface of the semiconductor wafer to the bottom of the groove and dividing the wafer into individual semiconductor devices. <P>COPYRIGHT: (C)2004,JPO |
