| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for decreasing fears of the separation of solder balls from a bonding surface where they are formed and from a surface where a device to be mounted is placed, as well as its manufacturing method. <P>SOLUTION: On one side of a board material 11, where posts 12 to be connected to terminals of mounted devices are formed, buffer layers 14 which elastically expand and contract with the thermal expansion and contraction of the devices are formed. Semiconductor pellets 17 are placed in prescribed positions on it, connected with wires 18 and sealed in a resin material 20. Then the board material 11 is separated from the posts 12 and buffer layers 14. <P>COPYRIGHT: (C)2004,JPO |
