| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein two or more connectors are arranged in a lattice on the front and rear surface of a board and connected together direct through conductor members formed inside through-holes to improve the board in versatility for reducing the semiconductor device in cost. SOLUTION: The semiconductor device is composed of the package board 2 provided with two or more lands 2c which are arranged in a lattice at a regular pitch on its main surface 2a and rear surface 2b respectively and connected together directly through via interconnect lines 2d, a semiconductor chip 1 mounted on the main surface 2a of the package board 2, a plurality of wires 4 connecting the pads 1a of the semiconductor chip 1 to the lands 2c on the main surface 2a of the package board 2, a sealing part 6 which is formed above the main surface 2a of the package board 2 so as to seal up the semiconductor chip 1 and the wires 4, and a plurality of solder bumps 3 which are arranged in a lattice and connected to the lands 2c formed on the rear surface 2b of the package board 2. The semiconductor chip 1 having various sizes or the pads various in number can be mounted at an optional position on the main surface 2a of the package board 2, so that the package board 2 can be improved in versatility. COPYRIGHT: (C)2004,JPO |
