发明名称 HEAT DISSIPATING ASSEMBLY
摘要 A heat dissipating assembly (1) includes a plurality of fins (10), three heat pipes (20), and a base (30). Each fin defines three through holes (11) across a middle portion thereof. A plurality of dome-shaped protruding portions (14) is formed in each fin. The protruding portions are arranged in a regular array of offset rows. Adjacent protruding portions in any row protrude from front and rear faces of the fin in a regular alternating configuration. One end of each heat pipe is respectively inserted into the corresponding through holes of the fins, and an opposite end of each heat pipe is attached in the base. The base is attached on an electronic device, for absorbing heat produced by the electronic device. The protruding portions increase a heat dissipating surface area of the fins, and deflect airflow that passes across the fins in a direction parallel to the fins.
申请公布号 US2004017659(A1) 申请公布日期 2004.01.29
申请号 US20020233026 申请日期 2002.08.31
申请人 JING CHENG-DU;HUAN LIN CHING 发明人 JING CHENG-DU;HUAN LIN CHING
分类号 G06F1/20;H01L23/427;H05K7/20;(IPC1-7):H05K7/20 主分类号 G06F1/20
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