Semiconductor package and substrate thereof

摘要

Disclosed is a semiconductor package characterized by having at least one cavity defined in a substrate and at least one buffer pad disposed in the at least one cavity. The semiconductor package includes a semiconductor chip disposed on the substrate, at least one conductive trace connecting with the buffer pad and at least one bonding wire electrically connecting the semiconductor chip to the buffer pad. The buffer pad has a thickness larger than the thickness of the conductive trace.