| 摘要 |
A thin hybrid integrated circuit device having a plurality of parts made into a unitary block. The hybrid integrated circuit device is a hybrid integrated circuit device including a first and a second module mounted on a mounting substrate having a wiring via a plurality of external electrode terminals at the lower surface. The device further includes a connection body made from a sealing resin covering the upper surface and side surface of the first and the second module and connecting the modules into a unitary structure. The external electrode terminals of the modules are electrically independent from each module. The first and the second module are composed of parts including a semiconductor chip and having electrode connection mounted on the upper surface of a multi-layered wiring substrate (ceramic substrate) having the plurality of external electrode terminals on the lower surface. Between the adjacent first and the second module, there is a space to separate them. The first module and the second module have different numbers of layers of the dielectric layer of the multi-layered wiring substrates. The external electrode terminals are independent for each module. |
