发明名称 MULTILAYER WIRING BOARD, METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR DEVICE AND RADIO ELECTRONIC DEVICE
摘要 <p>A multilayer wiring board exhibiting excellent moldability and having a capacitor where variation of capacitance is suppressed, its producing method, a semiconductor device mounting a semiconductor chip on the multilayer wiring board, and a radio electronic device mounting the semiconductor device.</p>
申请公布号 WO2004010751(A1) 申请公布日期 2004.01.29
申请号 WO2003JP06860 申请日期 2003.05.30
申请人 HITACHI CHEMICAL CO., LTD.;SHIMADA, YASUSHI;HIRATA, YOSHITAKA;KURIYA, HIROYUKI;OTSUKA, KAZUHISA;YAMAGUCHI, MASANORI;SHIMAYAMA, YUICHI;MADARAME, KEN;MIZUSHIMA, ETSUO;KONDOU, YUUSUKE;YAMAMOTO, KAZUNORI 发明人 SHIMADA, YASUSHI;HIRATA, YOSHITAKA;KURIYA, HIROYUKI;OTSUKA, KAZUHISA;YAMAGUCHI, MASANORI;SHIMAYAMA, YUICHI;MADARAME, KEN;MIZUSHIMA, ETSUO;KONDOU, YUUSUKE;YAMAMOTO, KAZUNORI
分类号 H05K1/16;H05K3/46;(IPC1-7):H05K1/16;H01G4/40;H01G4/18;H01F17/00 主分类号 H05K1/16
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