| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a glass-ceramic sintered compact having a thermal expansion coefficient and a dielectric constant higher than those of alumina and a multilayer circuit board excellent in the mounting reliability for an outer circuit board using the glass-ceramic sintered compact as a layer having a high dielectric constant. <P>SOLUTION: The glass-ceramic sintered compact contains a barium borosilicate glass phase of 35-65 mass%, a barium-strontium titanate phase of 15-60 mass%, and a strontium silicate phase of 10-35 mass%, which has a thermal expansion coefficient at 40-400°C of ≥9×10<SP>-6</SP>/°C and a specific dielectric constant at 1 MHz-3 GHz of ≥13. <P>COPYRIGHT: (C)2004,JPO |
