| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a simple and inexpensive IC packaged laminate body structure which remarkably reduces a dynamic stress to an IC caused by adhesives and is adhered by the adhesives improved in insulation, heat resistance, durability, weather resistance and chemical resistance, and an IC card. <P>SOLUTION: In the IC packaged laminate body structure in which two sheets are adhered by the adhesives while locating an IC unit between the two sheets, the adhesives contain, as essential components, (A): hydrocarbon polymer of molecular weight 500-300,000 having one or more alkenyl groups in molecules, (B): hardener, and (C): curing catalyst. <P>COPYRIGHT: (C)2004,JPO |
