| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition which has excellent compatibility with an epoxy resin, etc., electric properties and water absorption resistance, etc., and contains a dicyclopentadiene-based compound to be readily produced by using an inexpensive monomer, and a multilayer printed wiring board provided with an interlayer resin insulating layer using the thermosetting resin composition. SOLUTION: The thermosetting resin composition comprises (A) the dicyclopentadiene-based compound having a structural unit represented by general formula (1), (B) a compound containing an epoxy group and/or an oxetanyl group and in a preferable mode, (C) a rubber component. The thermosetting resin composition is preferably used as the interlayer resin insulating layer of the printed wiring board. COPYRIGHT: (C)2004,JPO |
