发明名称 MULTILAYER WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To solve problems that a contact part between a liquid crystal polymer layer in an insulating film and a through conductor is peeled off when a low melting point metal is blended with the through conductor, in a multilayer wiring board consisting of an insulting film obtained by forming coat layers of thermosetting resin on the upper and lower faces of liquid crystal polymer. SOLUTION: A part located in the liquid crystal polymer is formed by a 1st conductive material consisting of thermosetting resin of 6-15 weight %, silver of 2.5-10 weight % and copper of 82.5-84 weight %, and a contact part with a wiring conductor is formed by a 2nd conductive material consisting of thermosetting resin of 6-15 weight %, silver of 2-9 weight %, copper of 46-87 weight %, and tin or indium of 5-30 weight %. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004031816(A) 申请公布日期 2004.01.29
申请号 JP20020188457 申请日期 2002.06.27
申请人 KYOCERA CORP 发明人 HAGIWARA KIYOMI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址
您可能感兴趣的专利